Programmable interconnect structures and programmable integrated circuits

ABSTRACT

Antifuses and gate arrays with antifuses are disclosed that have high thermal stability, reduced size, reduced leakage current, reduced capacitance in the unprogrammed state, improved manufacturing yield, and more controllable electrical characteristics. Some antifuses include spacers in the antifuse via. In some antifuses, the programmable material is planar, and the top or the bottom electrode is formed in the antifuse via. In some gate arrays, the antifuses are formed above the dielectric separating two levels of routing channels rather than below that dielectric.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of the U.S. patent application Ser.No. 08/651,102, filed on May 21, 1996, now U.S. Pat. No. 5,701,027,which is a continuation of the U.S. patent application Ser. No.07/892,466, filed on Jun. 1, 1992, now U.S. Pat. No. 5,557,136 issued onSep. 17, 1996, which is a continuation-in-part of the U.S. patentapplication Ser. No. 07/874,983 filed on Apr. 23, 1992 by K. E. Gordonand R. J. Wong now U.S. Pat. No. 5,196,724 issued on Mar. 23, 1993,which application is a continuation of the U.S. patent application Ser.No. 07/691,950 filed on Apr. 26, 1991 by K. E. Gordon and R. J. Wong,now abandoned. The aforementioned application Ser. No. 07/892,466 isalso a continuation-in-part of the U.S. patent application Ser. No.07/891,675 entitled "Amorphous Silicon Antifuses and Methods forFabrication Thereof" filed on May 28, 1992 by K. E. Gordon and R. J.Wong, now abandoned, which is a continuation of the U.S. patentapplication Ser. No. 07/698,648 filed on May 10, 1991 by K. E. Gordonand R. J. Wong, now abandoned. The disclosures of the aforementionedapplications Ser. No. 07/874,983, Ser. No. 07/691,950 and Ser. No.07/698,648 are hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to programmable integrated circuits andmethods for fabrication thereof, and more particularly to antifuses andcircuits and routing structures incorporating antifuses, and methods forfabrication thereof.

2. Description of Related Art

Programmable semiconductor devices include programmable read onlymemories ("PROMs"), programmable logic devices ("PLDs"), andprogrammable gate arrays. Programmable elements suitable for one or moreof these device types include fuses and antifuses.

A fuse is a structure which electrically couples a first terminal to asecond terminal, but which, when programmed by passage of sufficientcurrent between its terminals, electrically decouples the first terminalfrom the second terminal.

An antifuse is a structure which when unprogrammed does not electricallycouple its first and second terminals, but which, when programmed byapplying sufficient voltage between the first and second terminals,permanently electrically connects the first and second terminals. Onetype of antifuse comprises an amorphous silicon which forms conductivepolysilicon when heated.

FIG. 1 illustrates an example of antifuse technology for a CMOS circuit.Antifuses 10a and 10b are part of an array of such antifuses that areformed on a silicon semiconductor substrate 14 over an oxide layer 16.Before the antifuses are formed, layer 16 is patterned and etched toprovide contact openings (not shown) to transistor source/drain regions,and layer 16 is flowed to smooth the sides of the contact openings. Thecontact openings are formed before the antifuses in order not to exposethe antifuses to the high temperatures of the flowing step.

Antifuses 10a, 10b are formed as follows. The first layer 18 of TiW isdeposited over the entire surface of the substrate 14 and over one ormore circuit elements (not shown), such as transistor source/drainregions, which were exposed by the contact openings in layer 16. Thefirst TiW layer 18 serves two purposes: one, as a protective cover forthe exposed circuit elements while antifuses 10 are being formed, andthe other is to provide the bottom electrode for antifuses 10. Portionsof the first TiW layer 18 are appropriately masked, and the first etchof TiW 18 is performed to define the protective cover and the bottomelectrodes.

A layer of dielectric material 20 such as 2000 angstroms of oxide isformed over the TiW layer 18 and then masked and etched to defineantifuse vias 22a and 22b. The dielectric 20 is removed over thoseportions of the first TiW layer 18 which cover and protect the CMOScircuit elements.

A layer 25 of 1500 angstroms of amorphous silicon is then deposited. Asecond layer 26 of TiW is deposited over the amorphous silicon layer 25.The two layers are masked and etched to define the array of antifusessuch as typically shown at 10a, 10b.

Then the structure is masked, and a second etch of the TiW layer 18 isperformed to remove the portion of TiW layer 18 that has served as aprotective cover for the CMOS circuit elements.

Then first-metal aluminum 27 is formed on the second layer 26 of TiW foreach respective antifuse structure 10 when the first metallization forthe integrated circuit components is formed. Metal layers 26, 27 providethe top electrodes to antifuses 10.

A standard intermetal dielectric layer 28 is formed over the wafer. Viaslike via 29 are etched through dielectric layers 28 and 20 to the firstTiW layer 18. A conductor 30 of second-metal aluminum is formed over thedielectric layer 28 and in vias 29. Portions of conductor 30 in vias 29provide connections between the bottom electrodes 18 and the secondmetal 30 so as to reduce the connection resistance to the antifuses 10.See generally U.S. Pat. No. 4,914,055 issued Apr. 3, 1990 to Gordon etal.

Certain improvements are desirable in some prior art antifuse circuits,including reduced size, reduced leakage current (i.e. current in theunprogrammed state), reduced capacitance, greater reliability, improvedmanufacturing yield, and more controllable electrical characteristicssuch as leakage current, programming voltage, and capacitance in theunprogrammed state.

SUMMARY OF THE INVENTION

The present invention provides, in some embodiments, a reliable antifusewith reduced leakage current, reduced capacitance in the unprogrammedstate, improved yield and more controllable electrical characteristics.Reliability is also improved in that the antifuse, when programmed, isthermally stable, i.e. reliable in the presence of temperature changes.These advantages are achieved in some embodiments by providingdielectric spacers in the antifuse via. The spacers overlay the viasidewalls over the amorphous silicon and underlay the top electrode. Thespacers are advantageous for the following reasons.

When the antifuse is programmed, a conductive filament forms in theantifuse through a thinner portion of the amorphous silicon. The thinnerportion is often in the corner of the antifuse via, and hence, in priorart antifuses, the conductive filament is adjacent to the oxidesidewalls of the via. The oxide and the conductive filament havesignificantly different thermal expansion coefficients, and the thermalstress resulting from temperature variations can cause the conductivefilament to crack and become non-conductive, leading to circuit failure.

According to the invention, the dielectric spacers cover the cornerportions of the amorphous silicon, and hence the conductive filamentwill form farther away from the via sidewalls. The filament will besurrounded by the amorphous silicon. Because the filament and theamorphous silicon have similar thermal expansion coefficients, thethermal stress on the filament due to temperature variations becomesreduced, and the circuit reliability becomes therefore higher.

Other advantages over the prior art provided by the spacers in someembodiments include reduced leakage current, reduced capacitance in theunprogrammed state, improved yield and more controllable electricalcharacteristics, as explained more fully below.

The present invention also provides embodiments in which the amorphoussilicon layer is planar. The thermal stress on the conductive filamentresulting from temperature variations is low because the filamentthrough the planar amorphous silicon is surrounded by the amorphoussilicon and the filament does not laterally adjoin a material, such assilicon dioxide, with a significantly dissimilar thermal expansioncoefficient. Further, the planarity of the amorphous silicon facilitateshigh quality amorphous silicon deposition. Some of these embodimentsallow reduction in the antifuse size, as explained below.

The invention is not limited by the use of amorphous silicon. Otherprogrammable materials are used in some embodiments of the invention.

The present invention provides also programmable circuits, such as gatearrays, using antifuses. In some embodiments, the antifuses are formedover the intermetal dielectric. This arrangement provides betterprotection for the underlying transistors (typically gate arraytransistors) during the antifuse formation. That arrangement alsoprovides better protection for the antifuses because the antifuses arenot exposed to the high temperatures present during the formation of theintermetal dielectric and the first-metal contacts. The capacitance insome gate arrays also becomes reduced as explained below.

Other features of the invention are described below. The invention isdefined by the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-section illustration of a portion of a prior art CMOSintegrated circuit having amorphous silicon antifuses;

FIG. 2 is a cross-section illustration of an antifuse in the circuit ofFIG. 1;

FIGS. 3-7 are cross-section illustrations of antifuses according to thepresent invention;

FIG. 8 is a circuit diagram of a gate array according to the invention;

FIGS. 9 and 10 are cross section illustrations of gate arraysrepresented by the circuit diagram of FIG. 8;

FIG. 11 is a circuit diagram detailing a portion of the gate array ofFIG. 10;

FIG. 12 is a cross section illustration of another gate arrayrepresented by the circuit diagram of FIG. 8.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 2 shows a prior art antifuse 10, such as antifuses 10a, 10b of FIG.1, after the antifuse has been programmed by applying a programmingvoltage and passing a programming current between the top electrodelayers 26, 27 and bottom electrode layer 18. During programming, theamorphous silicon 25, which is non-conductive, forms a conductivefilament at its thinner portion. Current flows through the programmingpath heating the amorphous silicon 25 and forming a conductive filament210. Filament 210 includes a mixture of silicon, tungsten, tungstensilicide and titanium. The tungsten, both pure and in the form oftungsten silicide, and the titanium are from TiW layers 18 and 26. TheTiW of layers 18 and 26 is about 90% by weight tungsten and about 10% byweight titanium, so the total amount of tungsten in filament 210,including the pure tungsten and the tungsten in the tungsten silicide,exceeds the amount of titanium in filament 210.

Amorphous silicon 25, formed by chemical vapor deposition, is typicallythinner near the bottom corners of via 22 as shown at 220a, 220b in FIG.2. See A. C. Adams, "Plasma Deposition of Inorganic Films," Solid StateTechnology, April 1983, pages 135-139 incorporated herein by reference.During programming, amorphous silicon 25 breaks down at such a thinnerportion, portion 220a in FIG. 2, and conductive filament 210 forms inthe corner of via 22. The width of conductive filament 210 depends onthe programming current. In a typical application, in order to reducethe antifuse resistance to 50 Ω or below, filament 210 is made to be atleast 0.15μ wide. More particularly, the filament in top view istypically an oval stretched out along the edge of via 22. The width ofthe filament oval is about 0.15μ, and the length of the oval is about0.3μ. At this width, lateral surface 230 of filament 210 typicallycontacts silicon dioxide 20 or is quite close to silicon dioxide 20.

As a result, conductive filament 210 is much affected 25 by the thermalstress resulting from the effect of the difference between the thermalexpansion coefficients of the silicon dioxide 20 on the one hand and thematerial of conductive filament 210 (i.e., mixture of silicon, tungsten,tungsten silicide and titanium) on the other hand during changes in thetemperature of the circuit. Table 1 below lists the linear thermalexpansion coefficients (LTECs) of the materials involved.

                  TABLE 1    ______________________________________              Linear Thermal Expansion              Coefficient (LTEC), at 25° C.,    Material  times 10.sup.7, per degree Celsius    ______________________________________    SiO.sub.2 5.0    Si        26    WSi.sub.2 62.5 to 79    W         45    Ti        85    ______________________________________

As Table 1 indicates, the LTECs of the materials of conductive filament210 are at a minimum over five times greater than the LTEC of silicondioxide. The thermal stress, caused by cooling or heating of thestructure, between filament 210 and silicon dioxide 20 can causefilament 210 to crack. If filament 210 cracks, the low resistance pathbetween the electrodes 18 and 26, 27 will no longer exist, and thecircuit using the antifuse will fail.

FIG. 3 shows an antifuse 310 in which the thermal stress on theconductive filament is reduced. Antifuse 310 includes dielectric spacers320a, 320b that overlay the thinner portions 220a, 220b of amorphoussilicon 25. Spacers 320a, 320b force the conductive filament 210 to formaway from the sidewalls of via 22, in the thinnest amorphous siliconportion not covered by the spacers. Thus, the programming path, i.e. thelocation at which the conductive filament forms during programming, ismoved away from the sidewalls. The thermal stress on filament 210 isreduced because filament 210 is surrounded laterally by amorphoussilicon 25 and because conductive filament 210 and amorphous silicon 25have similar thermal expansion coefficients.

Dielectric spacers 320a, 320b provide also the advantages of reducedleakage current, increased yield, more controllable electricalcharacteristics and reduced capacitance in antifuse 310. The leakagecurrent is reduced because spacers 320a, 320b reduce the contact areabetween the TiW layer 26 and amorphous silicon 25. In one embodiment,the radius of the amorphous silicon on the bottom of via 22 betweenthinner portions 220a, 220b is 0.5μ. The spacer width at the bottom ofthe spacer is 0.1μ. Thus the spacers reduce the contract area at thebottom of via 22 between amorphous silicon 25 and the TiW layer 26 fromπ×(0.5μ)² =0.25πμ² to π×(0.4μ)² =0.16πμ², i.e, more than 1.5 times. Theleakage current is reduced proportionately. In one embodiment in whichthe amorphous silicon thickness at the bottom of via 22 varies fromabout 850Å at thinner portions 220a, 220b to about 1000Å in the middleof the via, the leakage current is over 1.5 nA if spacers 320a, 320b arenot used, and the leakage current is about 1.0 nA with the spacers.

The yield is increased because spacers 320a, 320b improve the stepcoverage of TiW layer 26 and, by improving the step coverage, thespacers help prevent aluminum 27 from spiking into amorphous silicon 25.Namely, TiW layer 26 is a barrier layer that prevents aluminum of layer27 from spiking into the amorphous silicon 25. Aluminum spikes areundesirable because they increase leakage current and, moreover, canshort the antifuse. In antifuse 10 of the prior art FIG. 2, barrierlayer 26 is thinned on the sidewalls of amorphous silicon 25 and overthinner portions 220a, 220b of the amorphous silicon. Discontinuities inbarrier layer 26 are also possible. The aluminum of layer 27 could spikethrough the thinner portions or discontinuities of barrier layer 26,mixing into amorphous silicon 25. In antifuse 310, spacers 320a, 320bsmooth the surface on which barrier layer 26 is deposited. Barrier layer26 as formed in the structure of FIG. 3 has more uniform thickness andis not thinned as much in via 22 as in the structure of FIG. 2.Discontinuities in barrier layer 26 are also less likely. Hence theprobability of antifuses rendered inoperative by spiking is reduced, andthe yield is improved.

The antifuse electrical characteristics are more controllable for thefollowing reasons. The electrical characteristics which include theprogramming voltage, the leakage current and the capacitance in theunprogrammed state, depend on the thickness of the amorphous silicon.The amorphous silicon thickness is more difficult to control in the viacorners near the sidewalls. By covering the amorphous silicon portionsin the corners, the spacers reduce the effect of these portions on theantifuse electrical characteristics. The electrical characteristicsbecome more dependent on the more controllable amorphous siliconthickness away from the sidewalls. The electrical characteristics hencebecome more controllable and easier to reproduce.

Spacers 320a, 320b reduce the capacitance of antifuse 310 in theunprogrammed state by moving portions of the top electrode layers 26, 27farther from the bottom electrode 18. Since the capacitance is reduced,the circuit speed is increased.

In some embodiments, via 22 is round in top view (not shown). Spacers320a, 320b are parts of one contiguous, annular spacer that runs alongthe bottom corner of via 22. Thinner portions 220a, 220b of amorphoussilicon 25 are also part of one contiguous thinner portion running alongthe bottom corner of via 22.

Antifuse 310 is fabricated as follows. First dielectric layer 16,typically of silicon dioxide, is formed on a silicon substrate (notshown), and patterned to expose portions of the substrate.Alternatively, the dielectric layer 16 may be formed upon a lowerconductive layer (not shown) rather than on the substrate. Firstconductive layer 18 is formed on dielectric layer 16 and patterned toform appropriate interconnects. The first conductive layer 18 providesthe bottom electrode of antifuse 310. In one embodiment, the firstconductive layer 18 is a layer of a barrier metal such as titaniumtungsten (TiW), about 2000 angstroms thick, deposited by sputtering.Other conductive materials may also be used.

Second dielectric layer 20 is formed on the first conductive layer 18.In one embodiment, the second dielectric layer 20 is a layer of silicondioxide, about 3000 angstroms thick, deposited using plasma enhancedchemical vapor deposition ("PECVD"). The second dielectric layer 20 ispatterned to form vias, such as via 22, exposing first conductive layer18.

Layer 25 of amorphous silicon is deposited and patterned over antifusevia 22. As is explained in U.S. patent application Ser. No. 07/447,969filed Dec. 8, 1989 whose disclosure is hereby incorporated herein byreference thereto, the thickness of amorphous silicon layer 25 incontact with first conductive layer 18 at the bottom of antifuse via 22is an important factor in controlling the programming voltage of theantifuse. In this embodiment, the thickness of amorphous silicon layer25 is about 1600 angstroms, which results in a programming voltage ofabout 12 volts. Of course, other programming voltages may be achieved bydepositing the amorphous silicon layer 25 to an appropriate thickness.Further, layer thickness and feature size are selected to minimizeleakage current, consistent with the process used and the programmingvoltage desired. In the present embodiment, the feature size is about1.2 μm and, as has been mentioned, the layer thickness is 1600angstroms.

In one embodiment, the amorphous silicon layer 25 is deposited usingplasma enhanced chemical vapor deposition ("PECVD"). A suitable reactoris the Concept One reactor available from Novellus Systems, Inc., SanJose, Calif. The process reactants are SiH4 and argon. The reaction iscarried out at a temperature of 400° C. In general, temperatures withinthe range of about 200° C. to about 500° C. are believed suitable. Theresultant deposition and evolved by-products are amorphous silicon andhydrogen.

Amorphous silicon formation by PECVD is described generally in A. C.Adams, "Plasma Deposition of Inorganic Films," Solid State Technology,April 1983, pages 135-139, hereby incorporated herein by referencethereto.

Next spacers 320a, 320b are formed as follows. A substantially conformallayer of silicon dioxide, about 2000 angstroms thick, is deposited byPECVD over the amorphous silicon 25. A suitable reactor is the ConceptOne reactor described hereinabove. The process reactants are SiH4 andoxygen. The deposition is carried out at 400° C. This silicon dioxidelayer is etched using isotropic reactive ion etching ("RIE") to formspacers 320a and 320b over the respective thinner portions 220a and220b. Spacers 320a and 320b smooth the surface above the amorphoussilicon layer 25 and thus improve the top electrode step coverage.Further, spacers 320a and 320b reduce leakage current.

In one embodiment, spacers 220a, 220b are formed of silicon nitride.

About 2000 angstrom layer 26 of titanium tungsten (TiW) and about 8000angstrom layer 27 of aluminum-copper (AlCu) are sputter deposited andpatterned to form the top electrode. Spacers 320a and 320b smooth thetopography and improve the TiW layer 26 step coverage.

In some embodiments, spacers 320a, 320b are formed under amorphoussilicon 25 directly over bottom electrode 18. See FIG. 3A.

FIG. 4 shows an antifuse 410 in which high thermal stability is achievedby making amorphous silicon 25 planar and not surrounded laterally nearvia 22 by silicon dioxide. Antifuse 410 includes a first dielectriclayer 16 formed on the silicon substrate (not shown) or on a lowerconductive layer (not shown). First conductive layer 18 providing thebottom electrode is deposited over dielectric layer 16. Bottom electrode18 in some embodiments is an about 2000 Angstrom thick layer of abarrier metal such as TiW.

Amorphous silicon layer 25, 1600 Angstroms thick in one embodiment, isdeposited above bottom electrode 18 by plasma enhanced chemical vapordeposition (PECVD) using the process described above in connection withFIG. 3.

A second dielectric layer 20 is formed over amorphous silicon layer 25.In one embodiment, second dielectric layer 20 is a layer of silicondioxide, about 3000 angstroms thick, deposited using PECVD. The seconddielectric layer 20 is patterned to form vias, such as via 22, exposingthe amorphous silicon 25. These vias, in particular via 22, will serveas sites for antifuses.

A dielectric material, such as silicon dioxide or silicon nitride, isdeposited and etched isotropically to form spacers 320a, 320b over thesidewalls of via 22.

About 2000 angstrom layer 26 of TiW and about 8000 angstrom layer 27 ofaluminum-copper are sputter deposited and patterned to form the topelectrode. TiW layer 26 serves to prevent the aluminum of AlCu layer 27from spiking into the amorphous silicon 25. Aluminum spikes areundesirable because they increase the leakage current or even short theantifuse.

Conductive filament 210 of antifuse 410 is surrounded laterally by theunprogrammed amorphous silicon 25. Since the amorphous silicon and thematerial of conductive filament 210 have similar thermal expansioncoefficients, high thermal stability is achieved.

Spacers 320a, 320b reduce the leakage current by reducing the contactarea between barrier layer 26 and amorphous silicon 25 and by providingadditional resistance between barrier layer 26 and first conductivelayer 18.

Spacers 320a, 320b also increase the yield of antifuse 410 by improvingthe step coverage of barrier layer 26 so as to reduce or eliminate thethinning of the barrier layer.

Another factor improving the yield is that the amorphous silicon 25 isplanar and hence a high quality deposition with reproducible and uniformthickness is facilitated. Of note, the thickness and the thicknessuniformity of the amorphous silicon are an important factor incontrolling the antifuse programming voltage, leakage current and thecapacitance in the unprogrammed state.

Spacers 320a, 320b reduce the capacitance of antifuse 410 in theunprogrammed state by moving portions of the top electrode layers 26, 27farther from the bottom electrode layer 18.

In some embodiments, spacers 320a, 320b are omitted. One such embodimentis disclosed in the aforementioned U.S. patent application Ser. No.07/691,950 filed by K. E. Gordon and R. J. Wong.

FIG. 5 shows a cross section of another thermally stable antifuse 510described in the aforementioned U.S. patent application Ser. No.07/698,648 filed by K. E. Gordon and R. J. Wong. Antifuse 510 is formedas follows.

First dielectric layer 16, typically of silicon dioxide, is formed andpatterned as described above in connection with FIG. 3. First conductivelayer 538 is formed on dielectric layer 16 and patterned to formappropriate interconnects. In one embodiment, the first conductive layer538 is a layer of aluminum. In another embodiment, the first conductivelayer 538 is TiW. In still another embodiment, the first conductivelayer 538 comprises various conductive layers (not shown), including athin layer of titanium covered by a thicker layer of aluminum. Otherconductive layers are suitable as well.

A second dielectric layer 540 is formed on the first conductive layer538. The second dielectric layer 540 is patterned to form vias, such asvia 544, exposing the first conductive layer 538.

A plug 545 of conductive material is formed in via 544 so as to fill thevia. Plug 545 provides the bottom electrode of the antifuse. The topsurface of plug 545 is substantially coplanar with the top surface ofthe second dielectric layer 540. Consequently, to-be-formed amorphoussilicon layer 25 will be planar. Formation of high quality, uniformlayer 25 is thereby facilitated. Further, the planarity of amorphoussilicon layer 25 improves the thermal stability of the antifuse becauseconductive filament 210, formed when antifuse 510 is programmed, will belaterally surrounded by amorphous silicon.

In one embodiment, plug 545 is made of tungsten. Tungsten plugs havebeen used to provide interlevel contacts between different conductivelayers. Any suitable tungsten plug deposition technique may be used. Forexample, in one technique, plug 545 is formed by selective chemicalvapor deposition ("CVD") of tungsten in the via 544. At the bottom ofvia 544, the material of first conductive layer 538 reacts with gaseousreactants so as to form tungsten in via 544. No tungsten is deposited,however, on top of the second dielectric layer 540 during the selectiveCVD. Selective CVD of tungsten is described generally in R. V. Joshi etal., "Low-Resistance Submicron CVD W Interlevel Via Plugs on Al-Cu-Si,"VMIC Conference, Jun. 12-13, 1989, pp. 113-121, available from theInstitute of Electrical and Electronic Engineers ("IEEE") of Piscataway,N.J. and hereby incorporated herein by reference thereto. See also T.Ohba, "Selective and Blanket Tungsten Interconnection and itsSuitability for 0.2-Micron ULSI," VMIC Conference, Jun. 12-13, 1990, pp.226-232, available from IEEE and hereby incorporated herein by referencethereto; T. Moriya et al., "A Planar Metallization Process--ItsApplication to Tri-Level Aluminum Interconnection," 83 IEDM 550, herebyincorporated herein by reference thereto.

In another technique, plug 545 is formed by a blanket CVD of tungstenfollowed by etch-back. The blanket CVD of tungsten provides a tungstenlayer with a planar top surface. The tungsten layer is etched untiltungsten is etched off the top of the second dielectric layer 540. In avariation, a thin adhesion layer of TiW (not shown) is sputtered on thesurface of the via 544 before the blanket CVD of the tungsten layer. Inanother variation, a sacrificial layer of silicon nitride (not shown) isdeposited on top of the second dielectric layer 540 before the via 544is formed. The silicon nitride protects the surface of the seconddielectric layer 540 and reduces the loading effects during the etch ofthe tungsten layer. After the etch, the remaining silicon nitride isremoved. Tungsten plug formation by blanket CVD and etch-back isgenerally described in J. M. F. G. van Laarhoven et al., "A NovelBlanket Tungsten Etchback Scheme," VMIC Conference, Jun. 12-13, 1989,pp. 129-135, available from IEEE and hereby incorporated herein byreference thereto.

In another variation, plug 545 is formed by selective CVD of tungsteninto the lower portion of via 544 and then by the blanket CVD oftungsten and an etch-back so as to fill up the via 544. See generally T.Ohba et al., supra.

Layer 25 of amorphous silicon is deposited and patterned over the via544. Layer 25 is planar, and deposition of high quality amorphoussilicon having uniform thickness and consistent, easily reproduciblephysical and electrical characteristics is thereby facilitated. Theyield is therefore improved. In one embodiment, the thickness ofamorphous silicon layer 25 is about 1600 angstroms. Of course, otherthicknesses are suitable depending on the programming voltage desired.

As described in the above-mentioned application Ser. No. 07/447,969, onefactor controlling leakage current is the manner of deposition of theamorphous silicon layer 25. In one embodiment, the amorphous siliconlayer 25 is deposited using plasma enhanced chemical vapor deposition("PECVD"). A suitable reactor is the Concept One reactor available fromthe Novellus Systems, Inc., San Jose, Calif. Suitable reactants andprocess parameters are described generally in the above-mentionedapplication Ser. No. 07/447,969.

The second electrode of antifuse 510 is formed by sputter depositing anabout 2000 angstrom barrier layer 26 of titanium tungsten (TiW) and anabout 8000 angstrom layer 27 of aluminum-copper (AlCu). TiW layer 26 andAlCu layer 27 are patterned to form the second electrode. The mask usedfor patterning the second electrode layers 26 and 27 is smaller than themask used to pattern the amorphous silicon 25 so that, in the worstmisalignment case, the entire second electrode is above amorphoussilicon 25. Portions of the amorphous silicon 25 that are exposed by thesecond electrode mask are etched away when layers 26 and 27 are etchedduring the second electrode formation.

Layers 26 and 27 are planar over the amorphous silicon 25. Theirplanarity facilitates deposition of layers 26 and 27 and thus improvesthe antifuse yield. In particular, the planarity of barrier layer 26helps obtain more uniform thickness and eliminate discontinuities in thebarrier layer and thus improves the antifuse yield, as explained abovein connection with FIG. 3.

As is seen from the above description, antifuse 510 is fabricated usingfairly few process steps. Further, the process sequence provides aplanar top surface for the amorphous silicon deposition and the topelectrode formation, improving the yield and reproducibility of theelectrical characteristics. Further, if plug 545 is made of tungsten, nobarrier layer between the amorphous silicon 25 and the first conductivelayer 538 is needed even if aluminum is used in the first conductivelayer 538.

The use of plug 545 as the bottom electrode allows reducing the area ofantifuse 510 because a high quality plug with a good contact to firstconductive layer 538 can be formed even when via 544 is narrow relativeto the thickness of the second dielectric layer 540. Because of thesmall area of antifuse 510, leakage current and the capacitance of theunprogrammed antifuse are reduced. Of note, in field programmable gatearrays (FPGAs) with thousands or millions of antifuses, even a smallsize reduction of each antifuse may provide a significant overall sizereduction of the FPGA. Further, the second dielectric layer 540 can bemade quite thick so as to reduce the capacitance between the firstconductive routing channels formed from the first conductive layer 538and the second conductive routing channels formed from TiW layer 26 andAlCu layer 27. The FPGA speed is increased as a result.

FIG. 6 shows an antifuse 610 similar to antifuse 510. In antifuse 610,plug 545 only partially fills the antifuse via 544. Depending on themanufacturing processes available, formation of plug 545 which onlypartially fills the via may be simpler than formation of plug 545 whichcompletely fills the via as in FIG. 5. However, plug 545 of FIG. 6provides some of the advantages of plug 545 of FIG. 5. In particular,the structure of FIG. 6 allows reducing the antifuse size, leakagecurrent and capacitance, improving the antifuse yield and making theantifuse electrical characteristics more controllable. Namely, plug 545of FIG. 6 reduces the depth to which amorphous silicon 25, TiW layer 26and AlCu layer 27 are deposited in via 544, and hence plug 545facilitates high quality deposition of the three layers even when via544 is narrow and second dielectric layer 540 is thick. Thus the size,and hence also the leakage current and the capacitance, are reduced, theyield is increased and the electrical characteristics are easier tocontrol and reproduce as explained above in connection with FIG. 5.

FIG. 7 shows an antifuse 710 which is similar to antifuse 610 but whichincludes dielectric spacers 320a, 320b over thinner portions 220a, 220bof amorphous silicon 25. Spacers 320a, 320b are formed in someembodiments of silicon dioxide or silicon nitride similarly to spacers320a, 320b of FIG. 3. Spacers 320a, 320b of FIG. 7 increase the antifusethermal stability by moving conductive filament 210 farther from silicondioxide layer 540. Spacers 320a, 320b reduce the leakage current byreducing the contact area between barrier layer 26 and amorphous silicon25. The spacers improve the yield by improving the thickness uniformityof barrier layer 26 as discussed above in connection with FIG. 3. Thespacers make the antifuse electrical characteristics more controllablebecause the spacers cover the amorphous silicon portions in the viacorners, as discussed above in connection with FIG. 3. The spacersreduce the capacitance, and hence increase the circuit speed, by movingportions of top electrode layers 26, 27 farther from plug 545. See thediscussion above in connection with FIG. 3.

The antifuses of FIGS. 3-7 are suitable for use in field programmablegate arrays such as the gate arrays disclosed in the U.S. patentapplication Ser. No. 07/738,707 filed by K. E. Gordon and A. K. Chan onJul. 31, 1991 now U.S. Pat. No. 5,302,546 issued on Apr. 12, 1994, andhereby incorporated herein by reference and U.S. patent application Ser.No. 07/665,103 filed on March 6, 1991 by A. K. Chan et al., now U.S.Pat. No. 5,122,685 issued on Jun. 16, 1992 and hereby incorporatedherein by reference. FIG. 8 shows a simplified circuit diagram of such agate array 810. Gate array 810 has an array of logic cells 820-i,j,i,j=1,2. Gate arrays generally may include hundreds or thousands oflogic cells. Gate array 810 includes also horizontal channels 830-i,i=1, . . . , 10 and vertical channels 840-i, i=1, . . . , 4. Verticalchannels 840-i are substantially orthogonal to horizontal channels830-i. Antifuses ("cross links") such as shown, for example, at 850-1,1,850-1,2 are provided at intersections of the channels. Each cross linkis an antifuse of one of the types described above in connection withFIGS. 3-7.

Horizontal channel 830-1 is a metal line connected to a source/drainregion 860-1a of transistor 860-1 and to a source/drain region 860-2a oftransistor 860-2. Vertical channel 840-1 is a metal line connected tosource/drain regions 860-3a, 860-4a of respective transistors 860-3,860-4. Transistors 860-1, 860-2, 860-3 and 860-4 are part of theprogramming circuitry that programs the cross links 850-i,j as describedmore fully in the aforementioned application Ser. No. 07/738,707, nowU.S. Pat. No. 5,302,546. Source/drain regions 860-1a, 860-2a, 860-3a and860-4a are typically diffusion regions in a semiconductor substrate.

Each channel 830-i, 840-i is connected similarly to circuit elements(not shown) formed in the substrate such as transistor source/drainregions.

FIG. 9 shows a cross section of gate array 810 wherein cross links850-i,j are antifuses of the type described above in connection withFIG. 5. Substrate 900 is provided with a P-doped substrate region 904.Source/drain regions 860-1a, 860-1b of transistor 860-1 are formed inregion 904. Patterned oxide layers 918, 919 and 920 (shown in crosshatch) also are present. As is well known in the art, oxide layer 918 isa field oxide, boro-phosphosilicate glass layer 919 is a contact oxide,and oxide layer 920 comprises various oxide layers (not shown) formed inthe fabrication of gate 860-1c of transistor 860-1. The oxide layers918, 919 and 920 are suitably patterned and etched to form contact holesdown to the various source and drain regions including regions 860-1aand 860-1b.

Using standard techniques, a film 938 of aluminum measuring about 6000angstroms is sputtered over the patterned oxide layers and into thecontact holes to regions 860-1a and 860-1b. Other metals may be used aswell. Film 938 of FIG. 9 corresponds to first conductive layer 538 ofFIG. 5. Film 938 is patterned and etched using a BCl₃, Cl₂, CHCl₃standard aluminum dry etch to provide the horizontal channels, such aschannel 830-1, and contacts to source/drain regions of transistors860-i.

Intermetal dielectric 950 is a thick oxide layer, of about 9000angstroms thickness, deposited using any suitable standard techniquesuch as, for example, plasma enhanced chemical vapor deposition. Layer950 corresponds to the second dielectric layer 540 of FIG. 5. In one ofmany suitable techniques, layer 950 comprises two oxide layers (notshown). The first oxide layer is deposited to the selected thickness andplanarized. The planarization step involves spinning a resist layer overthe deposited oxide and reflowing the resist with a postbake, afterwhich the surface is planarized in an RIE etch-back adjusted for equalresist and oxide etch rates. A second oxide layer then is deposited toensure dielectric integrity and the 9000 angstrom thickness over theirregular topography.

Antifuse vias 544a and 544b are now formed through the oxide 950 down tothe horizontal channel 830-1. Similar vias are formed at the locationsof the other cross links. Other vias (not shown) are made at the sametime to provide direct connections between the to-be-formed verticalchannels 840-i and portions (not shown) of aluminum 938. These portionsof aluminum 938 contact the source/drain regions, such as regions 860-3aand 860-4a, which are to be connected to the vertical channels 840-i.Antifuse via masks used to pattern the oxide have the same dimension asthe direct-connection via masks. The vias are etched using standard RIEtechniques.

Conductive plugs 545a, 545b are formed in the respective vias 544a,544b. Similar plugs are formed at the locations of the other crosslinks. Plugs 545a, 545b provide bottom electrodes for the respectiveantifuses 850-1,1, 850-1,2. The top surface of the plugs issubstantially coplanar with the top surface of oxide 950.

Planar amorphous silicon layer 25 of about 1600 angstrom thickness isdeposited and patterned over the conductive plugs 545. In someembodiments, amorphous silicon layer 25 is deposited by PECVD asdescribed above in connection with FIG. 5.

An about 2000 angstrom layer 26 of TiW and an about 8000 angstrom layer27 of aluminum-copper are sputter deposited and patterned by standardtechniques to form the vertical channels 840-i. The portions of layers26 and 27 over vias 544 form the top electrodes of the respectiveantifuses 850. The portions (not shown) of layers 26 and 27 in theaforementioned direct-connection vias provide the above-described directconnections to aluminum 938.

Using standard techniques, a 5000 angstrom layer of silicon dioxide (notshown) is deposited and pad openings are patterned. Then a 10,000angstrom layer of silicon nitride (not shown) is deposited and padopenings are patterned. These oxide and nitride layers are used aspassivation layers. The structure is then alloyed at 400° C. usingstandard techniques.

The second level routing channels 840-i extend generally orthogonally tothe first level routing channels 830-i. Thick oxide 950 serves to reducethe capacitance between the first level routing channels 830 and thesecond level routing channels 840. In spite of the large thickness ofoxide layer 950, vias 544 can be made narrow because good quality plugs545 providing a good contact to aluminum layer 938 can be formed even innarrow vias. Significant size reduction of the gate array is therebymade possible. Leakage current and the capacitance of the unprogrammedantifuse are also reduced thereby.

In some variations of the gate array 810 of FIG. 9, the cross links850-i,j are of the type of antifuse 610 of FIG. 6 or antifuse 710 ofFIG. 7.

FIG. 10 shows a cross section of gate array 810 in which cross links850-i,j are of the type described above in connection with FIG. 3.Transistors 860-i, oxide layers and 918, 919 and 920, aluminum 938 andhorizontal channels 830-i, and intermetal dielectric 950 are formed asdescribed above in connection with FIG. 9.

Cross links 850-i,j are formed over the intermetal dielectric 950. Atthis time, transistor source/drain regions such as regions 860-1a,860-2a, 860-3a and 860-4a are protected by intermetal dielectric 950 andby first level contacts formed from layer 938. Thus the manufacture ofgate array 810 of FIG. 10 does not require a special protective cover toprotect the transistors during the antifuse formation like the coverrequired in the prior art circuit of FIG. 1. Moreover, the transistors860-i in FIG. 10 are protected better during the antifuse formationbecause the transistors are not exposed to the deposition and etch ofthe special protective cover itself.

Further, since antifuses 850-i,j are formed above intermetal dielectric950, the amorphous silicon of the antifuses is not degraded by the hightemperatures present in the formation of intermetal dielectric 950.

Antifuses 850-i,j are formed as follows. Bottom electrode layer 18 isdeposited and patterned. The bottom electrode layer 18 corresponds tothe first conductive layer 18 of FIG. 3 and provides the bottomelectrodes for the antifuses. In one embodiment, the bottom electrodelayer 18 is TiW, about 2000 angstroms thick, deposited by sputtering.

A dielectric layer 20 is formed over the bottom electrode layer 18. Inone embodiment, dielectric layer 20 is a layer of silicon dioxide, about3000 angstroms thick, deposited using PECVD. Dielectric layer 20 ispatterned to form antifuse vias 22a and 22b and contact vias 1020a and1020b exposing the bottom electrode layer 18. 1600 angstrom layer 25 ofamorphous silicon is deposited and patterned over the antifuse vias 22aand 22b. In some embodiments, amorphous silicon layer 25 is deposited byPECVD as described above in connection with FIG. 3.

Then the spacers are formed. A substantially conformal layer of silicondioxide, about 2000 angstroms thick, is deposited by PECVD over theamorphous silicon layer 25 and etched using isotropic RIE to formspacers 320a and 320b on the sidewalls of via 22a and similar spacers onthe sidewalls of via 22b. The spacers cover the thinner portions of theamorphous silicon 25.

Using standard photolithography and etching techniques, vias 1030a and1030b are formed in the dielectric layer 20 and the intermetaldielectric layer 950. Similar vias are formed for the other cross links.Vias 1030 terminate at the lower metal layer 938. Vias 1030 will allow aplurality of connections between the bottom electrode layer 18 and thelower metal layer 938.

Other vias (not shown) are formed at the same time to provide directconnections between the to-be-formed vertical channels 840-i andportions of aluminum 938 which portions contact source/drain regionsthat must be connected to vertical channels 840-i. See the discussionabove in connection with FIG. 9.

An about 2000 angstrom layer 26 of TiW and an about 8000 angstrom layer27 of aluminum-copper are sputter deposited and patterned by standardtechniques to form vertical routing channels 840-i and the topelectrodes of the antifuses. The portions of layers 26 and 27 in vias 22provide the top electrodes for antifuses 850-i,j. The portions of layers26 and 27 in vias 1020 and 1030 and between adjacent vias 1020 and 1030provide spaced-apart connections between the bottom electrode layer 18and the lower aluminum layer 938. These connections reduce theconnection resistance for antifuses 850-i,j. See generally U.S. Pat. No.4,914,055 issued Apr. 3, 1990 to Gordon et al. The disclosure of U.S.Pat. No. 4,914,055 is hereby incorporated herein by reference thereto.

Other portions (not shown) of layers 26 and 27 provide theabove-described direct connections to aluminum 938. See the discussionabove in connection with FIG. 9.

Using standard techniques, a 5000 angstrom layer of silicon dioxide (notshown) is deposited and pad openings are patterned. Then a 10,000angstrom layer of silicon nitride (not shown) is deposited and padopenings are patterned. These oxide and nitride layers are used aspassivation layers. The structure is then alloyed at 400° C. usingstandard techniques.

FIG. 11 shows a circuit diagram detailing a portion of gate array 810 ofFIG. 10. The bottom electrodes 18 of antifuses 850-1,1 and 850-1,2 areconnected to horizontal channel 830-1 at the location of vias 1030a,1030b. The bottom electrodes 18 of antifuses 850-1,3 and 850-1,4 arepart of a contiguous portion of layer 18 which portion is connected tohorizontal channel 830-1 at the location of similar vias 1030c, 1030d.In general, pairs of adjacent cross links 850-i,j share a contiguousportion of bottom electrode layer 18 which portion is connected to ahorizontal channel 830-i. In other embodiments, a greater number ofcross links share a contiguous portion of bottom electrode layer 18which portion is connected to a horizontal channel 830-i.

The circuit of FIGS. 10, 11 is fast because the overall capacitanceassociated with the metal layers is reduced. One factor reducing thecapacitance is the spacers such as spacers 320a, 320b as explained abovein connection with FIG. 3. Another factor is as follows. The capacitanceis affected by the following three metal structures: (1) the bottomstructure--horizontal channels 830-i; (2) the middle structure--bottomelectrode layer 18; and (3) the top structure--top electrode layers 26,27. While the middle layer 18 and the top layer 26, 27 may havedifferent potentials, the middle layer 18 and the bottom channel 830-iare at the same potential since the two layers are connected to eachother. Therefore, the capacitance between the middle layer 18 and thebottom channel 830-i is zero. By contrast, in the prior art of FIG. 1,the middle layer, which comprises TiW 26 and aluminum 27, may have adifferent potential from both the bottom layer 18 and the top layer 30.Thus, in FIGS. 10, 11, the overall capacitance is reduced, and thecircuit speed is increased as a result.

FIG. 12 shows a cross section of gate array 810 in which cross links850-i,j are of the type described above in connection with FIG. 4.Transistors 860-i, oxide layers 918, 919 and 920, aluminum 938 andhorizontal channels 830-i, and intermetal dielectric 950 are formed asdescribed above in connection with FIGS. 9 and 10.

Cross links 850-i,j are formed over intermetal dielectric 950. Thiseliminates the need for a special protective cover, provides a betterprotection for the transistors during the cross link formation, andprevents the amorphous silicon of the cross links from being degradedduring the formation of the intermetal dielectric, as described above inconnection with FIG. 10.

Antifuses 850-i,j of FIG. 12 are formed as follows. Bottom electrodelayer 18 is deposited and patterned as described above in connectionwith FIG. 10. Amorphous silicon layer 25 and dielectric layer 20 arethen formed as described above in connection with FIG. 4. Dielectriclayer 20 is patterned to form antifuse vias 22a and 22b and contact vias1020a and 1020b. Similar vias are formed for the other cross links. Theantifuse vias 22a and 22b expose amorphous silicon 25, and the contactvias 1020a and 1020b expose the bottom electrode layer 18.

Then spacers 320b, 320a in via 22a and similar spacers in via 22b areformed as described above in connection with FIG. 4.

Using standard photolithography and etching techniques, vias 1030a and1030b are formed in dielectric layer 20 and the intermetal dielectric950 as described above in connection with FIG. 10. Similar vias areformed for the other cross links. Other vias (not shown) are formed atthe same time to provide direct connections between the to-be-formedvertical channels 840-i and portions of aluminum 938 which portionscontact source/drain regions that must be connected to vertical channels840-i. See the discussion above in connection with FIG. 9.

Layer 26 of TiW and layer 27 of AlCu are deposited and patterned toprovide the top electrodes for antifuses 850-i,j and also to providespaced-apart connections between layers 18 and 938 as described above inconnection with FIG. 10.

The passivation layers of silicon dioxide (not shown) and siliconnitride (not shown) are then deposited and patterned as described abovein connection with FIG. 10.

The circuit diagram of FIG. 11 which diagram was discussed above asshowing gate array 810 of FIG. 10, applies also to gate array 810 ofFIG. 12.

In some variations of gate array 810 of FIG. 12, spacers 320a, 320b andthe similar spacers in the other antifuse vias are omitted.

Gate array 810 of FIG. 12 advantageously has a low capacitance, andhence a high speed, when compared to the circuit of the prior art FIG.1, as is seen from the discussion above in connection with FIG. 10.

While the invention has been illustrated with respect to the embodimentsdescribed above, other embodiments and variations not described hereinare within the scope of the invention. For example, the invention shouldnot be limited by the composition of the metal system used for theinterconnects, or by any specific thickness of the various films andoxides used in the structure. These other embodiments and variations areto be considered within the scope of the invention, as defined by thefollowing claims.

What is claimed is:
 1. An antifuse structure comprising:a first metalconductor; an insulating layer overlaying said first metal conductor,the insulating layer having an opening therethrough; a programmablematerial in the opening, the programmable material being non-conductivewhen the antifuse is unprogrammed, the programmable material providing aconductive path therethrough when the antifuse is programmed; a secondmetal conductor overlaying and contacting the programmable material inthe opening; and a sidewall spacer in the opening, the sidewall spacerbeing disposed between the first and second metal conductors.
 2. Theantifuse of claim 1 wherein the spacer overlays the programmablematerial.
 3. The antifuse of claim 1 wherein the spacer underlays theprogrammable material.
 4. The antifuse of claim 1 wherein theprogrammable material comprises amorphous silicon.
 5. The antifuse ofclaim 1 wherein the spacer is dielectric.
 6. The antifuse structure ofclaim 5 wherein the second metal conductor comprises:a conductivematerial; and a barrier metal separating said conductive material fromsaid programmable material for preventing the conductive material fromspiking into said programmable material.
 7. The antifuse structure ofclaim 6 wherein:said conductive material comprises aluminum; and saidprogrammable material comprises amorphous silicon.
 8. The antifusestructure of claim 7 wherein the barrier metal comprises titaniumtungsten.
 9. The antifuse structure of claim 1 wherein, when saidstructure is programmed, said conductive path is surrounded laterally bya material whose linear thermal expansion coefficient (LTEC) and an LTECof said conductive path are such that, at 25° C., neither one of saidtwo LTECs is more than four (4) times greater than the other one of saidtwo LTECs.
 10. The antifuse structure of claim 1 wherein, when saidstructure is programmed, said conductive path is laterally surrounded byan unprogrammed portion of said programmable material.
 11. The antifusestructure of claim 1 wherein, when said structure is programmed, saidconductive path and said insulating layer have, at 25° C., differentLTECs such that one of said LTECs is at least five (5) times as great asthe other one of said two LTECs.
 12. The antifuse structure of claim 11wherein, at 25° C., the LTEC of the insulating layer is at least five(5) times lower than the LTEC of the conductive path.
 13. The antifuseof claim 1 wherein the spacer is silicon dioxide.
 14. The antifuse ofclaim 1 wherein the spacer improves step coverage of the second metalconductor, and wherein the spacer reduces leakage current between thefirst and second metal conductors through the programmable material whenthe antifuse is unprogrammed.
 15. The antifuse of claim 1 wherein whenthe antifuse is programmed, the spacer causes the conductive paththrough the programmable material to be located farther from a sidewallof the opening.
 16. A method for fabricating an antifuse structure foran integrated circuit, the method comprising:fabricating a first metalconductor; fabricating an insulating layer overlaying the first metalconductor; fabricating an opening through the insulating layer andterminating the opening at the first metal conductor; fabricating aprogrammable material in contact with the first metal conductor in theopening, the programmable material being non-conductive when theantifuse is unprogrammed, the programmable material providing aconductive path therethrough when the antifuse is programmed;fabricating a sidewall spacer which contacts the programmable material,wherein at least a portion of an area of contact between the spacer andthe programmable material is located in the opening; and fabricating asecond metal conductor contacting and overlaying the programmablematerial in the opening and overlaying the spacer.
 17. The method ofclaim 16 wherein the spacer is fabricated after the programmablematerial.
 18. The method of claim 16 wherein the conductive path and theinsulating layer have different linear thermal expansion coefficients(LTECs) at 25° C. such that one of said LTECs is at least five (5) timesas great as the other one of said LTECs.
 19. The method of claim 16wherein, when the antifuse structure is programmed, the conductive pathis laterally surrounded by a material whose LTEC and an LTEC of theconductive path are such that neither one of said two LTECs is more thanfour (4) times greater than the other one of said two LTECs.
 20. Themethod of claim 16 wherein the programmable material comprises amorphoussilicon.
 21. The method of claim 16 wherein the spacer is dielectric.22. The method of claim 21 wherein the second metal conductorcomprises:a conductive material; and a barrier metal separating saidconductive material from said programmable material for preventing theconductive material from spiking into said programmable material. 23.The method of claim 22 wherein:said conductive material comprisesaluminum; and said programmable material comprises amorphous silicon.24. The method of claim 23 wherein the barrier metal comprises titaniumtungsten.
 25. The method of claim 16 wherein the spacer is silicondioxide.
 26. The method of claim 16 wherein the spacer improves stepcoverage of the second metal conductor, and wherein the spacer reducesleakage current between the first and second metal conductors throughthe programmable material when the antifuse is unprogrammed.
 27. Amethod for fabricating an antifuse structure for an integrated circuit,the method comprising:fabricating a first metal conductor; fabricatingan insulating layer overlaying the first metal conductor; fabricating anopening through the insulating layer and terminating the opening at thefirst metal conductor; fabricating a programmable material in contactwith the first metal conductor in the opening, the programmable materialbeing non-conductive when the antifuse is unprogrammed, the programmablematerial providing a conductive path therethrough when the antifuse isprogrammed; fabricating a sidewall spacer which contacts theprogrammable material, wherein an area of contact between the spacer andthe programmable material is at least partially located in the opening;and fabricating a second metal conductor contacting and overlaying theprogrammable material in the opening and overlaying the spacer, whereinwhen the antifuse is programmed, the spacer causes the conductive paththrough the programmable material to be located farther from a sidewallof the opening.
 28. A method for fabricating an antifuse structure foran integrated circuit, the method comprising:fabricating a first metalconductor; fabricating an insulating layer overlaying the first metalconductor; fabricating an opening through the insulating layer andterminating the opening at the first metal conductor; fabricating aprogrammable material in contact with the first metal conductor in theopening, the programmable material being non-conductive when theantifuse is unprogrammed, the programmable material providing aconductive path therethrough when the antifuse is programmed;fabricating a sidewall spacer which contacts the programmable material,wherein an area of contact between the spacer and the programmablematerial is at least partially located in the opening; and fabricating asecond metal conductor contacting and overlaying the programmablematerial in the opening and overlaying the spacer, wherein the spacer isfabricated before the programmable material.